JPH03126074U - - Google Patents
Info
- Publication number
- JPH03126074U JPH03126074U JP3594690U JP3594690U JPH03126074U JP H03126074 U JPH03126074 U JP H03126074U JP 3594690 U JP3594690 U JP 3594690U JP 3594690 U JP3594690 U JP 3594690U JP H03126074 U JPH03126074 U JP H03126074U
- Authority
- JP
- Japan
- Prior art keywords
- rigid
- wiring board
- wall
- conductive wires
- flexible composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3594690U JPH03126074U (en]) | 1990-04-02 | 1990-04-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3594690U JPH03126074U (en]) | 1990-04-02 | 1990-04-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03126074U true JPH03126074U (en]) | 1991-12-19 |
Family
ID=31541743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3594690U Pending JPH03126074U (en]) | 1990-04-02 | 1990-04-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03126074U (en]) |
-
1990
- 1990-04-02 JP JP3594690U patent/JPH03126074U/ja active Pending